Upon cooling from the deposition temperature to room temperature, the difference in the thermal expansion coefficients of the substrate and the film cause thermal stress. Thermal stress occurs because film depositions are usually made above room temperature. Stress in the semiconductor structure involving evaporated thin films usually results from the thermal expansion (thermal stress) during the manufacturing process. Radius of curvature is also used in a three part equation for bending of beams.For the radius of curvature of the earth (approximated by an oblate ellipsoid) see also: arc measurement.For the use in differential geometry, see Cesàro equation.In the case of a plane curve, then R is the absolute value of R ≡ | d s d φ | = 1 κ, Applications ![]() ![]() ![]() In the case of a space curve, the radius of curvature is the length of the curvature vector.
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